learning about packaging for IC semiconductor from the die form until complete
- Subject:
- Electronic Technology
- Engineering
- Manufacturing
- Material Type:
- Module
- Author:
- Puteri Nadia Dayanie Megat Sabri
- Date Added:
- 11/27/2017
learning about packaging for IC semiconductor from the die form until complete
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Processess used to operate on different types of material in the manufacturing industry are described.
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